There were some edits, changes, and clarifications in going from “F” to “G” in the IPC-J-STD-001.
As a reminder, the IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies is the “how to build it” document” for electronics assembly manufacturing. This standard continues to spell out methods, materials and verification data methods for producing quality soldered interconnections to meet a variety of end-user environments. The IPC-J-STD-001 Revision G still focuses in on process control while setting industry-consensus requirements for a broad range of electronic products.
There were some changes in the standards with respect to the wires and terminals section. Pinholes, dewetting and other soldering defects for tinning a wire. There was also some clarification on how wires can or cannot wrap around one another.
In the surface mount section, there were some changes in the new J-STD-001 Revision “G”. There were some clarifications on the circular mounted components such as MELFs in terms of solder touching the component body. There was also a clarification on the solder terminations on various components. In section 10 there was a newly written section that was broken out on how SMT components are to be staked.
Overall there were some fairly minor changes in the document in expectation of a major change on cleanliness testing for process control. This will be handled and voted on as an amendment to the document due out sometime in the next 12-18 months. This effort is being led by a sub-committee.
The changes in the standards in moving form IPC-J-STD-001 “F” to version “G” were fully discussed in a webinar here:
This was presented by James Barnhart IPC-JSTD-001 an IPC Master Instructor.
There are several tools needed to perform the training for the IPC-J-STD-001. One of them is the solder training kit which can be purchased from here. The IPC J-STD-001 revision G can also be purchased from here. Both of these tools are required one per student. The standard can be used over and over again while the soldering kit is used one time per student. The soldering can be done using lead-free solder or a combination of both lead-free and lead-based solder.
In terms of timing the IPC-JSTD-001 G certification training is completed in from 1-5 days with the first days’ material being mandatory and the remainder-SMT, through-hole, wires and terminals and inspection all being “optional”. In the certification training for the instructor level for the IPC-J-STD-001 training program, the entire standard is covered over a period of (5) days. Here is a brief rundown of all of the materials covered in the IPC J-STD-001 training program for trainers:
Use of statistical process controls methods including control charting and upper and lower control limits and confidence intervals
Where to find the various test methods and how they are used as they are related to the IPC-J-STD-001 standard
There were some changes in the standards with respect to the wires and terminals section. Pinholes, dewetting and other soldering defects for tinning a wire. There was also some clarification on how wires can or cannot wrap around one another.
In the surface mount section, there were some changes in the new J-STD-001 Revision “G”. There were some clarifications on the circular mounted components such as MELFs in terms of solder touching the component body. There was also a clarification on the solder terminations on various components. In section 10 there was a newly written section that was broken out on how SMT components are to be staked.
Overall there were some fairly minor changes in the document in expectation of a major change on cleanliness testing for process control. This will be handled and voted on as an amendment to the document due out sometime in the next 12-18 months. This effort is being led by a sub-committee.
The changes in the standards in moving form IPC-J-STD-001 “F” to version “G” were fully discussed in a webinar here:
This was presented by James Barnhart IPC-JSTD-001 an IPC Master Instructor.
There are several tools needed to perform the training for the IPC-J-STD-001. One of them is the solder training kit which can be purchased from here. The IPC J-STD-001 revision G can also be purchased from here. Both of these tools are required one per student. The standard can be used over and over again while the soldering kit is used one time per student. The soldering can be done using lead-free solder or a combination of both lead-free and lead-based solder.
In terms of timing the IPC-JSTD-001 G certification training is completed in from 1-5 days with the first days’ material being mandatory and the remainder-SMT, through-hole, wires and terminals and inspection all being “optional”. In the certification training for the instructor level for the IPC-J-STD-001 training program, the entire standard is covered over a period of (5) days. Here is a brief rundown of all of the materials covered in the IPC J-STD-001 training program for trainers:
Use of statistical process controls methods including control charting and upper and lower control limits and confidence intervals
Where to find the various test methods and how they are used as they are related to the IPC-J-STD-001 standard
- Acceptance criteria for visual inspection of solder joints
- Demonstration on SMT assembly techniques
- Demonstration of through-hole assembly techniques
- General requirements in electronics assembly including ESD, MSD, lighting and magnification requirements
- Wire and wire terminal assembly techniques
- Program requirements while being an IPC certified trainer for the IPC-J-STD-001 G program.
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